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Chapter 1 – Introduction
Revision 1.1
1
1.1
Introduction
General Description
PRELIMINARY
SanDisk iNAND Product Manual
The SanDisk iNAND is a very small, flash storage device, designed specifically for storage
applications that put a premium on small form factor, low power and low cost. Flash is the
ideal storage medium for portable, battery-powered devices. It features low power
consumption and is non-volatile, requiring no power to maintain the stored data. It also has
a wide operating range for temperature, shock and vibration. It is compatible with the JC64
FBGA 169, 0.5mm ball pitch, package.
SanDisk iNAND is well-suited to meet the needs of small, low power, electronic devices.
With form factors measuring 12mm x 16mm x 1.2 mm and 12mm x 18mm x 1.2mm,
iNAND is expected to be used in a wide variety of portable devices like mobile phones,
pagers, and voice recorders.
To support this wide range of applications, iNAND is offered with an SD Interface. The SD
interface product is fully compatible with iNAND products, and provides a 4-bit data bus
for maximum performance. For compatibility with existing controllers, the iNAND offers,
in addition to these interfaces, an alternate communication-protocol based on the SPI
standard.
These interfaces allow for easy integration into any design, regardless of which type of
microprocessor is used. All device and interface configuration data (such as maximum
frequency and card identification) are stored on the device.
The SanDisk iNAND provides up to 8 GB of memory for use in mass storage applications.
In addition to the mass-storage-specific flash memory chip, iNAND includes an intelligent
controller, which manages interface protocols, data storage and retrieval, error correction
code (ECC) algorithms, defect handling and diagnostics, power management, wear
leveling, and clock control. Figure 1-1 is a block diagram of the SanDisk iNAND with SD
Interface.
Figure 1-1
SanDisk iNAND Block Diagram
SanDisk iNAND2
SD Bus/SPI Bus
Interface
? 2007 SanDisk Corporation
SanDisk
Single Chip
Controller
1-1
Data In/Out
Control
Flash
Memory
02/09/07
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相关代理商/技术参数
SDIN2C1-512M 功能描述:IC INAND FLASH 512MB 169FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF)
SDIN2C1-512M-Q 功能描述:IC INAND FLASH 512MB 169FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF)
SDIN2C1-512M-T 功能描述:IC INAND FLASH 512MB 169FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF)
SDIN2C2-1G 功能描述:IC INAND FLASH 1GB 169FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF)
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SDIN2C2-2G 功能描述:IC INAND FLASH 2GB 169FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF)
SDIN2C2-2G-T 功能描述:IC INAND FLASH 2GB 169FBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF)
SDIN2C2-8G 制造商:SanDisk Corporation 功能描述:8GB, 169FBGA 12X16, OEM